Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-08-26
1993-06-08
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156645, 156657, 156663, 437228, 437247, 437974, H01L 2100
Patent
active
052175669
ABSTRACT:
A glass passivation layer is deposited, densified and polished. Thereby an underlying wafer containing substantially defined devices is exposed to a temperature cycle that is sufficient for densification of the glass, and no more. Reflow and its attendant additional temperature cycle are thereby avoided, allowing for smaller, faster devices to be fabricated. Increased control over the ultimate thickness of the glass layer is also provided.
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Thin Film Process, by Vossen et al., pp. 497-521, 1978.
Pasch Nicholas F.
Patrick Roger
Dang Thi
Linden Gerald E.
LSI Logic Corporation
Rostoker Michael D.
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