Densifying and polishing glass layers

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156645, 156657, 156663, 437228, 437247, 437974, H01L 2100

Patent

active

052175669

ABSTRACT:
A glass passivation layer is deposited, densified and polished. Thereby an underlying wafer containing substantially defined devices is exposed to a temperature cycle that is sufficient for densification of the glass, and no more. Reflow and its attendant additional temperature cycle are thereby avoided, allowing for smaller, faster devices to be fabricated. Increased control over the ultimate thickness of the glass layer is also provided.

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Thin Film Process, by Vossen et al., pp. 497-521, 1978.

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