Degassing method and apparatus

Details Degassing method and apparatus Degassing method and apparatus

1997-07-10

2000-09-05

Bueker, Richard

Coating apparatus

Gas or vapor deposition

C23C 1600

Patent

active

061136980

ABSTRACT:
An apparatus and method for clamping and heating a wafer without using moving parts and without exposing the wafer to external stress is provided. A high backside wafer pressure which provides efficient heat transfer from a heated substrate support to the wafer is offset by a high frontside wafer pressure higher than or lower than the backside wafer pressure. The high frontside pressure reduces wafer stress by providing a uniform frontside/backside pressure and presses the wafer against the heated substrate support. A continuous gas purge for providing a viscous flow across the wafer to carry away desorbed contaminants, and frontside heating elements for improving desorption are provided.

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