Deformation resistant shielding composition

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

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260897B, 174102SC, H01B 106

Patent

active

039518710

ABSTRACT:
A deformation resistant semi-conducting composition is formed from low density thermoplastic ethylene copolymer, carbon black, thermoplastic crystalline high density ethylene polymer or propylene resin and a thermoplastic elastomer.
The composition is useful as insulation shielding material or as conductor shielding material in high voltage wire and cable.

REFERENCES:
patent: 3445546 (1969-05-01), Pledger
patent: 3735025 (1973-05-01), Ling et al.
patent: 3816347 (1974-06-01), Lush
patent: 3849333 (1974-11-01), Lloyd et al.

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