Deformable semiconductor device

Details Deformable semiconductor device Deformable semiconductor device

2006-11-21

2006-11-21

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23092, C257SE25011, C257SE29022, C257SE25013, C257S737000, C257S738000, C257S773000, C257S795000, C257S779000, C257S793000, C361S748000, C361S764000

Reexamination Certificate

active

07138723

ABSTRACT:
A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.

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