Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Patent
1997-05-30
2000-10-31
Gupta, Yogendra
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
134 2, 134 3, C11D 904, C03C 2300, C23G 102
Patent
active
061402869
ABSTRACT:
The defluxing agent for flux residue after soldering contains an acid (preferably an organic acid, and particularly an acid stronger than abietic acid; for example, acrylic acid, acetic acid, propionic acid, benzoic acid) and an organic solvent (for example, xylene, benzyl acetate, methyl .alpha.-hydroxyisobutyrate, cyclohexanone, methyl .beta.-methoxyisobutyrate), and if necessary it further contains a monohydric alcohol, a surfactant and a corrosion inhibitor. Rinsing is preferably performed after the cleaning, using a solvent which is miscible with the defluxing agent, in order to completely remove the acid. There is also disclosed a cleaning apparatus which may be generally used for this and other cleaning.
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Chemical Abstracts, vol. 107, No. 2, Jul. 13, 1987, Columbus, Ohio.
English language abstract of Japanese Patent Publication 04068090 (Asahi Chem. Ind. Co.) Mar. 3, 1992.
Igusa Nobuo
Ochiai Masayuki
Takachi Isamu
Watanabe Keiji
Yamagishi Yasuo
Fujitsu Limited
Gupta Yogendra
Petruncio John M
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