Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-09-20
2008-08-12
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S761000, C438S776000, C438S782000, C257S635000, C257S766000, C204S157450, C204S157500, C204S633000
Reexamination Certificate
active
07410899
ABSTRACT:
Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
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Office Action dated Jul. 10, 2007, U.S. Appl. No. 11/243,624, filed Oct. 5, 2005.
Chen Qingyun
Hurtubise Richard
Paneccasio Vincent
Petrov Nicolai
Stritch Daniel
Enthone Inc.
Fourson George
Garcia Joannie A
Senniger Powers LLP
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