Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-02-20
2007-02-20
Bali, Vikkram (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
Reexamination Certificate
active
10081782
ABSTRACT:
An image picked up by a detection system capable of actualizing a three-dimensional inclination is usually poor in the signal-to-noise ratio, and it is difficult to stably detect minute defects. Images that actualize a three-dimensional inclination are picked up from opposed directions. The images are subject to subtraction and addition. The images improved in signal-to-noise ratio as compared with original images are calculated. The images calculated and improved in signal-to-noise ratio respectively of a defect portion and a reference portion are compared with each other. Regions differing in comparison results are detected as defects. As a result, minute defects can be inspected stably.
REFERENCES:
patent: 5659172 (1997-08-01), Wagner et al.
patent: 6947587 (2005-09-01), Maeda et al.
patent: 6965429 (2005-11-01), Honda et al.
patent: 01-143127 (1989-06-01), None
Berhold Klaus Paul Horn, “Reflectance Map: Shape from Shading,”Robot Vision(1986), The MIT Press (Boston), pp. 245-277.
Honda Toshifumi
Kitahashi Katsuhiro
Okuda Hirohito
Ozawa Yasuhiko
Bali Vikkram
Hitachi , Ltd.
Townsend and Townsend / and Crew LLP
LandOfFree
Defect inspection method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Defect inspection method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Defect inspection method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3894847