Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-11-13
2007-11-13
Le, Brian (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S147000, C382S149000, C382S232000
Reexamination Certificate
active
10260374
ABSTRACT:
A method of detecting a defect in a reticle or wafer uses wavelet transforms to differentiate between real defects and pattern noise. A first image and a second image of a sample are aligned. A wavelet transform is obtained of the difference between the images. The wavelet transformed difference image is filtered to distinguish between real defects and pattern defects.
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Beyer & Weaver, LLP
KLA-Tencor Technologies Corporation
Le Brian
LandOfFree
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