Defect analysis methods for semiconductor integrated circuit...

Details Defect analysis methods for semiconductor integrated circuit... Defect analysis methods for semiconductor integrated circuit...

2008-01-15

2010-10-26

Le, John H (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Mechanical measurement system

C365S200000, C365S201000, C702S083000

Reexamination Certificate

active

07822561

ABSTRACT:
A defect analysis method includes storing, in a database, data indicative of defects and analog characteristics of corresponding defective bits in a database. A first defective area in a first wafer is found, and analog characteristics of defective bits in the first defective area are measured. The measured analog characteristics and the analog characteristics stored in the database are compared to locate a defect causing the first defective area.

REFERENCES:
patent: 5844850 (1998-12-01), Tsutsui et al.
patent: 5991699 (1999-11-01), Kulkarni et al.
patent: 2008/0080277 (2008-04-01), Lee
patent: 2005-142406 (2005-06-01), None
patent: 10-2002-0008108 (2002-01-01), None
patent: 1020050049604 (2005-05-01), None
Korean Notice of Allowance (dated Jan. 29, 2008) for counterpart Korean Patent Application No. 10-2007-0004322 is provided for the purposes of certification under 37 C.F.R. §§ 1.97(e).

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