Deep ultraviolet light photoresist processing

Details Deep ultraviolet light photoresist processing Deep ultraviolet light photoresist processing

1993-10-13

1999-10-05

Chea, Thorl

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Including heating

430309, G03C 500

Patent

active

059621966

ABSTRACT:
Process for post exposure treatment of a latent image on a semiconductor wafer. After a deep ultraviolet (UV) photoresist has been exposed, the wafer, including the latent image in the attached photoresist, is maintained in an inert gas to protect the resist from the air atmosphere. Then the latent image is baked to stabilize the image.

REFERENCES:
patent: 4348473 (1982-09-01), Okumura et al.
patent: 4386152 (1983-05-01), Lai
patent: 4775609 (1988-10-01), McFarland
patent: 4885232 (1989-12-01), Spark
patent: 4921778 (1990-05-01), Thackeray et al.
patent: 4992356 (1991-02-01), Jeffries, III et al.
patent: 5019448 (1991-05-01), Mammato et al.
patent: 5019488 (1991-05-01), Mammato
Nalamasu, et al., "Development of a Chemically Amplified Positive (CAMP) Resist Material for Single Layer Deep-UV Lithography", 1990, pp. 32-48.
Nalamasu, et al., "Preliminary Llithographic Characteristics of an All-organic Chemically Amplified Resist Formulation for Single Layer Deep-UV Lithography", 1991, pp. 13-25.
MacDonald, et al., "Airborne Chemical Contamination of a Chemically Amplified Resist", 1991, pp. 2-12.

Affiliated with

Also associated with

Rating

Deep ultraviolet light photoresist processing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Deep ultraviolet light photoresist processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Deep ultraviolet light photoresist processing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1169824