Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-03-29
1997-02-25
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566461, 1566431, H01L 21302
Patent
active
056056036
ABSTRACT:
A high yield process for creating uniform deep trenches in a crystalline silicon substrate is disclosed. The process involves immobilizing a crystalline silicon substrate on an electrostatic chuck in a plasma etching apparatus, heating the silicon substrate by raising the cathode temperature to 30.degree. to 80.degree. C., exposing the silicon substrate to a plasma generated from HBr, NF.sub.3, and O.sub.2 ; and carrying out a plasma etch with the temperature of the cathode held at 30.degree. to 80.degree. C.
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Grimard Dennis S.
Marmillion Neal P.
Breneman R. Bruce
Goudreau George
International Business Machines - Corporation
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