Decoupling capacitor for an integrated circuit and method of...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

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C361S306100, C361S306300, C361S303000, C361S321200, C438S386000, C438S387000

Reexamination Certificate

active

07123465

ABSTRACT:
A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.

REFERENCES:
patent: 5103283 (1992-04-01), Hite
patent: 5422782 (1995-06-01), Hernandez et al.
patent: 6137161 (2000-10-01), Gilliland et al.
patent: 6191479 (2001-02-01), Herrell et al.
patent: 6515842 (2003-02-01), Hayworth et al.
patent: 6806568 (2004-10-01), Schaper
patent: 6812109 (2004-11-01), Ahn et al.
patent: 2000-349225 (2000-12-01), None
patent: 2005-072627 (2005-03-01), None
“Method for Soldering Capacitor Arrays Under BGAs to Improve Decoupling Capacitance”, priorartdatabase.com, Jan. 22, 2003, pp. 1-8.

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