Debris-free wafer marking method

Details Debris-free wafer marking method Debris-free wafer marking method

1998-04-06

1999-10-26

Breneman, Bruce

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

Mechanically forming pattern into a resist

216 43, 216 45, 438401, 438700, B44C 122, H01L 2131

Patent

active

059722347

ABSTRACT:
The present invention discloses a method for marking an electronic substrate without the splatter or debris defect which can be carried out by first providing a tape, then creating a cavity or a mark through the tape by a high-intensity energy beam or any other suitable mechanical means such that the tape can be laminated to a top surface of the substrate and exposed to an etchant until a similar mark in the substrate is reproduced by the etching process. After the tape is removed, the mark is reproduced in the surface of the electronic substrate.

REFERENCES:
patent: 5668030 (1997-09-01), Chung et al.
patent: 5759873 (1998-06-01), Kata et al.
patent: 5877064 (1999-03-01), Chang et al.

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