Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-10-10
2006-10-10
Vigushin, John B. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S793000, C361S795000, C174S258000, C174S262000, C257S691000, C257S698000, C257S700000
Reexamination Certificate
active
07120031
ABSTRACT:
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed of a high permittivity layer sandwiched between conductive planes. An organic portion of the substrate includes suitable routing and fan-out of power and signal conductors. The organic portion includes a build-up of multiple layers of organic material overlying the ceramic portion. Also described are an electronic system, a data processing system, and various methods of manufacture.
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Chakravorty Kishore K.
Figueroa David G.
Gupta Debabrata
Wermer Paul H.
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