Data processing for monitoring chemical mechanical polishing

Details Data processing for monitoring chemical mechanical polishing Data processing for monitoring chemical mechanical polishing

2006-03-07

2006-03-07

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S008000, C451S451000, C451S041000

Reexamination Certificate

active

07008296

ABSTRACT:
Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.

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