Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation
Reexamination Certificate
2006-03-30
2009-11-24
Feliciano, Eliseo Ramos (Department: 2857)
Data processing: measuring, calibrating, or testing
Measurement system in a specific environment
Quality evaluation
C702S127000, C702S128000, C702S183000, C438S016000
Reexamination Certificate
active
07623978
ABSTRACT:
A method of assessing damage of a dual damascene structure includes obtaining a wafer after the wafer has been processed using a dual damascene process. A first damage-assessment procedure is performed on the wafer using an optical metrology process to gather damage-assessment data for a first set of measurements sites on the wafer. For each measurement site in the first set of measurement sites, the optical metrology process determines an amount of damage of a damaged area of a periodic grating in the measurement site. The damage-assessment data includes the amount of damage determined by the optical metrology process. A first damage-assessment map is created for the dual damascene process. The first damage-assessment includes the damage-assessment data and the locations of the first set of measurement sites on the wafer. One or more values in the damage-assessment map are compared to damage-assessment limits established for the dual damascene process to identify the wafer as a damaged or undamaged wafer.
REFERENCES:
patent: 5903342 (1999-05-01), Yatsugake et al.
patent: 5966459 (1999-10-01), Chen et al.
patent: 6384909 (2002-05-01), Tomita et al.
patent: 6591405 (2003-07-01), Doddi
patent: 6608690 (2003-08-01), Niu et al.
patent: 6661515 (2003-12-01), Worster et al.
patent: 6694275 (2004-02-01), Jakadar et al.
patent: 6743646 (2004-06-01), Jakatdar et al.
patent: 6768983 (2004-07-01), Jakatdar et al.
patent: 6785638 (2004-08-01), Niu et al.
patent: 6818459 (2004-11-01), Wack et al.
patent: 6829559 (2004-12-01), Bultman et al.
patent: 6839145 (2005-01-01), Niu et al.
patent: 6853942 (2005-02-01), Drege et al.
patent: 6891626 (2005-05-01), Niu et al.
patent: 6928395 (2005-08-01), Niu et al.
patent: 6943900 (2005-09-01), Niu et al.
patent: 6947141 (2005-09-01), Bischoff et al.
patent: 6979823 (2005-12-01), Shinada et al.
patent: 6989899 (2006-01-01), Salnik et al.
patent: 7006235 (2006-02-01), Levy et al.
patent: 7046375 (2006-05-01), Bischoff et al.
patent: 7072049 (2006-07-01), Niu et al.
patent: 7235414 (2007-06-01), Subramanian et al.
patent: 7382451 (2008-06-01), Lin et al.
patent: 7502709 (2009-03-01), Funk et al.
patent: 2003/0198895 (2003-10-01), Toma et al.
patent: 2004/0017574 (2004-01-01), Vuong et al.
patent: 2004/0117055 (2004-06-01), Seidel et al.
patent: 2004/0181304 (2004-09-01), Collier
patent: 2004/0267397 (2004-12-01), Doddi et al.
patent: 2005/0057748 (2005-03-01), Vuong et al.
patent: 2005/0077597 (2005-04-01), Toma et al.
patent: 2005/0215072 (2005-09-01), Kevwitch et al.
patent: 2007/0077782 (2007-04-01), Lee et al.
patent: 2008/0076045 (2008-03-01), Willis et al.
Wolf, Stanley (Ph.D.) Excerpt from: Silicon Procession for the VLSI ERA, 2004, Lattice Press, vol. 4, p. 674-679.
Machavariani, V. et al. (2002). “Scatterometry—Interpretation by Different Methods of Electromagnetic Simulation,”Proceedings of SPIE—Metrology, Inspection, and Process Control for Microlithography XVI4689:177-188.
International Search Reprot and Written Opinion mailed Feb. 13, 2008, for PCT Application No. PCT/US07/08018 filed Mar. 29, 2007, 10 pages.
International Search Report and Written Opinion mailed Feb. 14, 2008, for PCT Application No. PCT/US07/07934 filed Mar. 29, 2007, 8 pages.
International Search Report and Written Opinion mailed Feb. 20, 2008, for PCT Application No. PCT/US07/08264 filed Mar. 29, 2007, 10 pages.
Stover, J.C. (1995).Optical Scattering-Measurement and Analysis, Second Edition, SPIE—The International Society for Optical Engineering: Bellingham, Washington, 5 pages (Table of Contents).
Moharam, M. G. et al. (May 1995). “Stable Implementation of the Rigorous Coupled-Wave Analysis for Surface-Relief Dielectric Gratings: Enhanced Transmittance Matrix Approach,”Journal of the Optical Society of America A12(5):1077-1086.
U.S. Appl. No. 11/395,636, filed Mar. 30, 2006 for Lally et al.
U.S. Appl. No. 11/396,210, filed Mar. 30, 2006 for Lally et al.
U.S. Appl. No. 11/396,214, filed Mar. 30, 2006 for Lally et al.
Funk Merritt
Lally Kevin
Sundararajan Radha
Feliciano Eliseo Ramos
Henson Mi′schita′
Morrison & Foerster / LLP
Tokyo Electron Limited
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