Dam for lead encapsulation

Electricity: conductors and insulators – Feedthrough or bushing – Compression

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Details

357 74, 357 69, 357 80, 174 524, H01L 2328, H01L 2302, H01L 2312, H01L 3902

Patent

active

051307812

ABSTRACT:
A method and apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.

REFERENCES:
patent: 4190855 (1980-02-01), Inoue
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4330790 (1982-05-01), Burns
patent: 4363076 (1982-12-01), McIver

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