CVD chamber cleaning using mixed PFCs from capture/recycle

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

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C134S001200, C134S010000, C134S022100, C438S905000, C216S067000

Reexamination Certificate

active

06837250

ABSTRACT:
A method of using PFCs recovered from the effluent of a CVD chamber cleaning process as an influent for the cleaning process is provided which includes the steps of selecting a first PFC gas mixture having a first ratio of C2F6to CF4, providing the first PFC gas mixture as the influent gas to the CVD chamber to create a CVD chamber effluent gas of a second PFC gas mixture having a second ratio of C2F6to CF4, adding virgin C2F6or CF4to the CVD chamber effluent gas in sufficient quantity to create a third PFC gas mixture having the first ratio of C2F6to CF4, and using the third PFC gas mixture as the influent gas to the CVD chamber.

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“Minimizing PFC Emissions From Existing . . . ”, Johnson, et al, Semicon West 2000.
“Electrical Optimization of Plasma-enhanced Chemical . . . ” Sobolewski, et al, J. Vac. Sci. Technol. B 16(1), 1998.
“Reduction of PFC Emissions by Gas Circulation Cleaning . . . ”, R. Nakata, et al, IEEEE Int'l Sym . . . , No. 58827, 2001, pp. 229-232.

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