Cutting of organic solids by continuous wave ultraviolet irradia

Details Cutting of organic solids by continuous wave ultraviolet irradia Cutting of organic solids by continuous wave ultraviolet irradia

1990-12-19

1993-05-18

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 156345, 2504921, 21912161, 21912167, 21912178, B44C 122

Patent

active

052118053

ABSTRACT:
A beam (12) of continuous wave ultraviolet light having a wavelength that is absorbed by an organic solid (20) is focused to a spot (18) on a surface of the organic solid (20). Relative motion is imparted between the beam (12) and organic solid (20) at a rate that defines, together with a dimension of the spot (18), an effective pulse width. Within prescribed ranges of the wavelength, power density and effective pulse width, a new cutting regime was discovered whereby organic solids can be cut at rates and with a quality of cuts previously requiring pulsed ultraviolet laser sources.

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