Customizable lid for improved thermal performance of modules usi

Details Customizable lid for improved thermal performance of modules usi Customizable lid for improved thermal performance of modules usi

1999-09-30

2000-07-18

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361703, 361705, 361706, 361707, 361708, 361709, 361714, 361717, 361718, 257706, 174 163, 165 802, 165 803, 165185, 16510433, H05K 720

Patent

active

060916036

ABSTRACT:
Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primary heat dissipation path. The lid structures and modules are made by processes wherein the lid understructure is customized for the chip(s) to be housed. The customization is achieved by the use of shims and a deformable lid understructure.

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