Curvature-based edge bump quantification

Details Curvature-based edge bump quantification Curvature-based edge bump quantification

2007-04-23

2010-12-14

Cosimano, Edward R (Department: 2857)

Data processing: measuring, calibrating, or testing

Measurement system

Dimensional determination

C073S865800, C356S237500, C356S600000, C382S145000, C382S149000, C702S081000, C702S187000, C702S189000

Reexamination Certificate

active

07853429

ABSTRACT:
Evaluating irregularities in surfaces of objects such as semiconductor wafers using a thickness profile of a surface section and analyzing the profile to obtain information of an irregularity start position, magnitude, and span along with surface slope and height information.

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SEMI M68-1108, 2007, 2008 (updated standard for Document No. 4209 of Semiconductor Equipment and Materials International, 3081 Zanker Road, San Jose, California 95134-2127, as referenced in the instant specification).

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