Curable encapsulant composition, device including same, and...

Coating processes – With post-treatment of coating or coating material – Heating or drying

Reexamination Certificate

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Details

C427S096200, C427S099200, C427S099400, C427S385500, C525S391000, C525S426000, C525S445000, C525S468000

Reexamination Certificate

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11167843

ABSTRACT:
An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

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Handbook of Fillers, 2nd Edition edited by Wypych, Chapter 6, Chem-Tec Publishing, 1999.

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