Coating processes – With post-treatment of coating or coating material – Heating or drying
Reexamination Certificate
2007-11-20
2007-11-20
Zimmer, Marc S. (Department: 1712)
Coating processes
With post-treatment of coating or coating material
Heating or drying
C427S096200, C427S099200, C427S099400, C427S385500, C525S391000, C525S426000, C525S445000, C525S468000
Reexamination Certificate
active
11167843
ABSTRACT:
An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.
REFERENCES:
patent: 4632798 (1986-12-01), Eickman et al.
patent: 4785057 (1988-11-01), Shiiki et al.
patent: 5218030 (1993-06-01), Katayose et al.
patent: 5272377 (1993-12-01), Shimozawa et al.
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5998876 (1999-12-01), Carter et al.
patent: 6617398 (2003-09-01), Yeager et al.
patent: 7067595 (2006-06-01), Zarnoch et al.
patent: 7101923 (2006-09-01), Campbell et al.
patent: 7148296 (2006-12-01), Zarnoch et al.
patent: 2003/0053782 (2003-03-01), Fabian et al.
patent: 2003/0096123 (2003-05-01), Yeager
patent: 2004/0082730 (2004-04-01), Japp et al.
patent: 2006/0041086 (2006-02-01), Birsak et al.
patent: WO 01/40354 (2001-06-01), None
patent: WO 03/072628 (2003-09-01), None
patent: WO 2005/033179 (2005-04-01), None
patent: WO 2005/035661 (2005-04-01), None
Handbook of Fillers, 2nd Edition edited by Wypych, Chapter 6, Chem-Tec Publishing, 1999.
Campbell John Robert
Duffey Bryan Patrick
O'Brien Michael Joseph
Susarla Prameela
Vallance Michael Alan
McClintic Shawn A.
Powell, III William E.
Zimmer Marc S.
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