Crystallization method

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S482000, C438S486000, C257S066000, C257S070000, C257SE21133, C257SE21324

Reexamination Certificate

active

07923317

ABSTRACT:
To crystallize a material, a thin layer of amorphous or polycrystalline material is deposited on at least one area of the surface of a top part of a substrate. A metal layer is then deposited on at least one area of the thin layer. Thermal treatment is then performed to enable crystalline growth of the material of the thin layer, resulting in:a rapid temperature increase of the top part of the substrate until liquid or overmelted liquid state is achieved,and heat transfer from the interface between the top part of the substrate and the thin layer to the interface between the thin layer and the metal layer.

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Hu et al., “Growth Mechanism of Laser Annealing of Nickel-Induced Lateral Crystallized Silicon Films”, Japanese Journal of Applied Physics, vol. 45, No. 1A, 2006, pp. 21-27.

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