Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-03-09
1991-11-12
Kunemund, Robert
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156667, 1566162, 1566163, 1566164, 15661641, 156DIG70, 156DIG83, 422248, 164122, 1641221, 1641222, C30B 1114
Patent
active
050644971
ABSTRACT:
In a compound semiconductor crystal growth process, the crucible (11) that contains the semiconductor melt is contacted on its opposite surface by a material (26) which, when melted, reacts with the crucible. The reacting material is melted along with the compound semiconductor material and thereafter reacts with the wall (24) of the crucible that contains the semiconductor melt. During the entire growth process, the wall is sufficiently thick to separate the reacting material from the compound semiconductor material, but is sufficiently thin that the reacting material significantly weakens its structural integrity. As a consequence, thermal stresses resulting from differential contraction of the compound semiconductor material and the wall during the cooling step are relieved by fracture of the crucible wall.
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"A Novel Application of the Vertical Gradient Freeze Method to the Growth of High Quality III-V Crystals," by W. A. Gault et al., Journal of Crystal Growth, vol. 74, 1986, pp. 491-506.
Clemans Jim E.
Ejim Theophilus I.
Yuen Maria J.
Anderson R. B.
AT&T Bell Laboratories
Kunemund Robert
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