Crystal formation method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156612, 156614, 156DIG70, 156DIG88, 437 83, 437 84, 437 89, C30B 2512

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active

052960870

ABSTRACT:
A crystal formation method is disclosed which is a crystal growth method comprising feeding two or more kinds of reactive starting gases alternately into a crystal formation treatment space having a substrate with a non-nucleation surface (S.sub.NDS) having small nucleation density and a nucleation surface (S.sub.NDL) having sufficiently small area for crystal growth only from a single nucleus, and larger nucleation density (ND.sub.L) than the nucleation density (ND.sub.S) of said non-nucleation surface (S.sub.NDS) being arranged adjacent to each other arranged therein, thereby permitting a monocrystal to grow selectively from said single nucleus, characterized in that when one of the starting gases is changed over to the other starting gas, the reaction vessel is once evacuated internally to 10.sup.-2 Torr or less.

REFERENCES:
patent: 3620833 (1971-11-01), Gleim et al.
patent: 4058430 (1977-11-01), Suntola et al.
patent: 4413022 (1983-11-01), Suntola et al.
patent: 4463492 (1984-08-01), Maeguchi et al.
patent: 4806321 (1989-02-01), Nishizawa et al.
Jastrzebski et al. "Growth Process of Silicon over SiO.sub.2 by CVD: ELO technique" J. Electrochem Soc. Jul. 1983 pp. 1571-1580.
Claassen et al. "The Nucleation of CVD Silicon on SiO.sub.2 and Si.sub.3 N.sub.4 Substrates" J. Electrochem Soc. Jan. 1980 pp. 194-202.
Nishizawa et al. "Crystal Growth by Atomic Layer Epitaxy" Tohoku University Jan. 23, 1984.

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