Cryogenic annealing of sputtering targets

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

20419212, 20429812, 20429813, 148577, C23C 1434

Patent

active

060568577

ABSTRACT:
Sputtering targets are cryogenically annealed to provide a uniformly dense molecular structure by placing the target in a temperature-controlled cryogenic chamber and cooling the chamber to a cryogenic temperature at a controlled rate. The target is maintained at a cryogenic temperature to cryogenically anneal the target and the target is subsequently returned to ambient or elevated temperature. Improvements in sputtered particle performance and early life film uniformity are achieved with the cryo-annealed targets.

REFERENCES:
patent: 2949392 (1960-08-01), Willey et al.
patent: 5160388 (1992-11-01), Legresy et al.

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