Creating or removing a conductive layer on an insulator over a s

Details Creating or removing a conductive layer on an insulator over a s Creating or removing a conductive layer on an insulator over a s

1986-04-29

1987-05-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156653, 156657, 1566591, B44C 122, C03C 1500, C03C 2506, H01L 21306

Patent

active

046647465

ABSTRACT:
A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.

REFERENCES:
patent: 2980594 (1961-04-01), Pankove

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