Crack-resistance semiconductor package and fabrication method th

Details Crack-resistance semiconductor package and fabrication method th Crack-resistance semiconductor package and fabrication method th

1997-07-28

2000-01-11

Picardat, Kevin M.

Semiconductor device manufacturing: process

Formation of semiconductive active region on any substrate

Fluid growth from gaseous state combined with subsequent...

438127, H01L 2144

Patent

active

060131098

ABSTRACT:
A crack-resistant fabrication method and fabrication apparatus for a semiconductor package prevents interface isolation and cracks by coating a semiconductor chip disposed in a semiconductor package, a paddle of a lead frame, bonding wires and a bond paste using a polyimide type coating material. The coating material forms a coating film to act as a buffering member. The fabrication method can include the steps of attaching a semiconductor chip on a paddle, electrically coupling the semiconductor chip and leads, forming a coating film on the surfaces of the semiconductor chip and the leads, and molding the semiconductor chip, the leads, and the coating film.

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