Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Patent
1995-05-12
1997-03-11
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
257417, 257418, 257419, 257704, H01L 2982
Patent
active
056104316
ABSTRACT:
A cover for a micromechanical device through which input/output connections to the device are made. The cover includes at least two doped semiconductor standoffs supporting an insulative layer. One or more metalized vias extend from a top surface of the insulative layer, or from a bottom surface of the base, to a respective standoff. Electrical connection is made to the covered device through the metalized vias and doped semiconductor standoffs. The covered chip may be vacuum sealed by providing a ring-like standoff which borders the covered device when the cover is bonded to the base. The resulting covered chip is adaptable for various chip mounting techniques, including flip chip mounting, side mounting combined with either tape automated bonding (TAB) or conductive epoxy connections, or epoxy chip attachment with wire bonding connections. In one embodiment, conductive bumps are formed on the top surface of the insulative cover layer to accommodate flip chip mounting. In another embodiment, conductive traces are run across the top surface of the insulative layer to interconnect the vias to respective edge positioned pads which are electrically interconnected by one of various techniques to pads on a wiring board.
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Crane Sara W.
Potter Roy
The Charles Stark Draper Laboratory Inc.
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