Cost effective structure and method for interconnecting a flip c

Details Cost effective structure and method for interconnecting a flip c Cost effective structure and method for interconnecting a flip c

1996-10-10

1998-06-09

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

29850, 2281791, 361760, 361772, 361773, 361776, H01R 909

Patent

active

057644861

ABSTRACT:
An electrical interconnection between a flip chip and a substrate. The interconnection includes a substrate having conductive pads to which wire bumps are attached. Each wire bump includes an elastically deformable stub section attached to the ball section, and a pointed tip. The pointed tip pierces a soft conductive layer located on a conductive pads of a flip chip. The elastic deformation of the stub section provides for consistent electrical connections between the flip chip and the substrate when the flip chip and the substrate are non-planar. An adhesive is located between the flip chip and the substrate and encompasses the wire bumps.

REFERENCES:
patent: 4975079 (1990-12-01), Beaman et al.
patent: 5056216 (1991-10-01), Madou et al.
patent: 5349495 (1994-09-01), Visel et al.
patent: 5561594 (1996-10-01), Wakefield

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