Correcting a defective metallization layer on an electronic comp

Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool

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51317, 427142, B24B 100

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active

051428288

ABSTRACT:
A defective metallization layer is removed from the top of an electronic component such as an integrated circuit or a copper/polyimide substrate by polishing with a rotating pad and a slurry. Non-defective underlying metallization layers are preserved and a new metallization layer is fabricated to replace the defective layer.

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