Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-12-16
1999-11-30
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562757, 156359, 1563809, 156497, 392422, B32B 3126
Patent
active
059935910
ABSTRACT:
A method and system for curing a die attach material for attachment of a semiconductor die to a leadframe which includes a carrier receiving location for receiving at least one carrier(1) wherein each carrier contains at least one leadframe strip (3) therein, a die attach material (15) on the leadframe strip and a semiconductor die (13) on the die attach material. A heat source (5) is provided for radiating thermal energy to the carrier receiving location. A reflector (9) is disposed around the heat source and the carrier receiving location for reflecting thermal energy from the heat source to the carrier receiving location. A source of flowing cool gas (11) is provided in heat exchange relationship with the reflector for cooling the reflector while heating the gas. The heated gas is passed through the carrier receiving location to provide a source of heat by convection at the carrier receiving location and purge the carrier receiving location of volatiles. The heat source provides radiations principally in the range of from about 0.5.mu. to about 2.0.mu. and is preferably a tungsten halogen lamp. The heat source is controllable responsive to a function of the instantaneous temperature of the die attach material and the leadframe strip to control the intensity and profile of the heat source. Cooling air is optionally injected into the system upon completion of curing.
REFERENCES:
patent: 3864547 (1975-02-01), Ray
patent: 4257172 (1981-03-01), Townsend
patent: 5332557 (1994-07-01), Sahoda et al.
patent: 5569402 (1996-10-01), Meisser et al.
patent: 5763856 (1998-06-01), Ohkase
patent: 5846476 (1998-12-01), Hwang et al.
Amador Gonzalo
Buendia Jesus S.
Heinen Katherine Gail
Stark Leslie E.
Ball Michael W.
Brady III Wade James
Donaldson Richard L.
Texas Instruments Incorporated
Tolin Michael A
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