Copper precursors for CVD/ALD/digital CVD of copper metal films

Details Copper precursors for CVD/ALD/digital CVD of copper metal films Copper precursors for CVD/ALD/digital CVD of copper metal films

2011-06-21

2011-06-21

Gonzalez, Porfirio Nazario (Department: 1621)

Organic compounds -- part of the class 532-570 series

Organic compounds

Heavy metal containing

C556S008000, C556S009000, C549S003000, C549S206000, C548S402000, C118S726000, C106S001260

Reexamination Certificate

active

07964746

ABSTRACT:
Copper precursors useful for depositing copper or copper-containing films on substrates, e.g., microelectronic device substrates or other surfaces. The precursors includes copper compounds of various classes, including copper borohydrides, copper compounds with cyclopentadienyl-type ligands, copper compounds with cyclopentadienyl-type and isocyanide ligands, and stabilized copper hydrides. The precursors can be utilized in solid or liquid forms that are volatilized to form precursor vapor for contacting with the substrate, to form deposited copper by techniques such as chemical vapor deposition (CVD), atomic layer deposition (ALD) or rapid vapor deposition (digital CVD).

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