Copper foil for printed circuit board, method for...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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Details

C428S209000, C428S615000, C428S626000, C428S658000, C174S257000

Reexamination Certificate

active

07344785

ABSTRACT:
A copper foil1comprises a roughened plating layer2, a Ni—Co alloy plating layer3, a zinc galvanized (underlying) layer4, a chromate treatment layer5, and a silane coupling treatment layer6on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer5is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.

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