Copper etching system

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

29852, 51281R, 134 7, 156638, 156645, 1566591, 156902, 204 15, 204 384, 427 97, 430313, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

045697205

ABSTRACT:
The invention relates to a novel process of etching a metal clad substrate which comprises contacting said substrate with one or more reactive gases, as for example ozone, to form one or more reaction products on the surface of the said metal which are more friable than said metal, and striking said reaction products with a plurality of abrasive particles.

REFERENCES:
patent: 4451327 (1984-05-01), Nelson

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