Copper etching solution and method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156656, 1566591, 156901, 252 791, 252 794, C23F 100, B44C 122, C09K 1300, C03C 1500

Patent

active

049522752

ABSTRACT:
A process and solution for selectively etching copper. The etching is effected by a nonaqueous solution of dimethyl sulfoxide and a halocarbon compound.

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