Copper etching process and solution

Details Copper etching process and solution Copper etching process and solution

1985-08-12

1986-12-30

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156666, 156902, 252 792, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

046327274

ABSTRACT:
Process and solution for etching copper, for example, to remove it from printed circuit boards. The etching is effected by an aqueous solution of nitric acid, a polymer which inhibits undercutting of the copper, a surfactant, and sulfuric acid and/or an alkane sulfonic acid such as methane sulfonic acid.

REFERENCES:
patent: 3367874 (1968-02-01), Haviland et al.
patent: 3702273 (1972-11-01), Johnston et al.
patent: 4497687 (1985-02-01), Nelson
patent: 4545850 (1985-10-01), Nelson

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