Copper etching bath and method of using

Details Copper etching bath and method of using Copper etching bath and method of using

1988-09-16

1991-01-01

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

252 792, C23F 100

Patent

active

049815539

ABSTRACT:
Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.

REFERENCES:
patent: 2834659 (1958-05-01), Mathre et al.
patent: 3345217 (1967-10-01), Wollgien et al.
patent: 3779842 (1973-12-01), Grunwald et al.
patent: 4144119 (1979-03-01), Dutkewych et al.
patent: 4788086 (1988-11-01), Matsuda
patent: 4849124 (1989-07-01), Backus
Encyclopedia of Chemical Technology, Third Edition, vol. 17, p. 428, (Phosphoric Acid).
Soviet Inventions Illustrated Sec C., Week 8639, Oct. 9th 1986, Class C, No. 86-257473/39, Derwent Publications.

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