Copper electroplating composition

Details Copper electroplating composition Copper electroplating composition

1989-11-20

1991-04-02

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 44, C25D 338

Patent

active

050045253

ABSTRACT:
A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

REFERENCES:
patent: 2931760 (1960-04-01), Westbrook
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3770598 (1973-11-01), Creutz
patent: 4374709 (1983-02-01), Combs
patent: 4384930 (1983-05-01), Eckles
patent: 4555315 (1985-11-01), Barbieri et al.

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