Copper doped low melt solder for component assembly and rework

Details Copper doped low melt solder for component assembly and rework Copper doped low melt solder for component assembly and rework

1989-05-31

1991-04-30

Sheehan, John P.

Alloys or metallic compositions

Tin base

Lead containing

420560, 420570, 420573, 420587, 420589, 22826311, 22826318, 2281801, C22C 1300

Patent

active

050116584

ABSTRACT:
Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

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