4. Alloys or metallic compositions
  5. Tin base
  6. Lead containing

Daniel S. Niedrich

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Applying solder to high density substrates

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Copper doped low melt solder for component assembly and rework

Alloys or metallic compositions – Tin base – Lead containing
Patent

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Profile ID: LFUS-PAI-P-862053

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