Copper deposition for filling features in manufacture of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S643000, C438S644000, C257SE23161, C257SE23163

Reexamination Certificate

active

07968455

ABSTRACT:
A method for plating copper onto a semiconductor integrated circuit device substrate by forming an initial metal deposit in the feature which has a profile comprising metal on the bottom of the feature and a segment of the sidewalls having essentially no metal thereon, electrolessly depositing copper onto the initial metal deposit to fill the feature with copper. A method for plating copper onto a semiconductor integrated circuit device substrate by forming a deposit comprising a copper wettable metal in the feature, forming a copper-based deposit on the top-field surface, and depositing copper onto the deposit comprising the copper wettable metal to fill the feature with copper.

REFERENCES:
patent: 6221230 (2001-04-01), Takeuchi et al.
patent: 6399479 (2002-06-01), Chen et al.
patent: 6610596 (2003-08-01), Lee et al.
patent: 6713373 (2004-03-01), Omstead
patent: 6897152 (2005-05-01), Verbunt
patent: 2002/0008034 (2002-01-01), Chen et al.
patent: 2004/0149584 (2004-08-01), Nagai et al.
patent: 2006/0014378 (2006-01-01), Aggarwal et al.
patent: 2006/0141784 (2006-06-01), Paneccasio, Jr. et al.
patent: 2006/0251872 (2006-11-01), Wang et al.
patent: 2006/0254503 (2006-11-01), Dai et al.
International Search Report, PCT/US2007/081671, dated Mar. 17, 2008, 2 pages.
Written Opinion, PCT/US2007/081671, dated Mar. 17, 2008, 6 pages.
International Preliminary Report on Patentability, PCT/US2007/081671, dated Apr. 22, 2009, 7 pages.

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