Copper conducting wire structure and fabricating method thereof

Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only

Reexamination Certificate

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Details

C349S046000, C349S122000, C428S210000, C257S249000

Reexamination Certificate

active

11219718

ABSTRACT:
A copper conducting wire structure is for use in the thin-film-transistor liquid crystal display (LCD) device. The copper conducting wire structure includes at least a buffer layer and a copper layer. A fabricating method of the copper conducting wire structure includes the following steps. At first, a glass substrate is provided. Next, the buffer layer is formed on the glass substrate. The buffer layer is comprised of a copper nitride. At last, the copper layer is formed on the buffer layer.

REFERENCES:
patent: 6111619 (2000-08-01), He et al.
patent: 6319741 (2001-11-01), Izumi et al.
patent: 6506675 (2003-01-01), Oomiya et al.
patent: 6562668 (2003-05-01), Jang et al.
patent: 6674502 (2004-01-01), Terakado et al.
patent: 7157323 (2007-01-01), Gan et al.
patent: 2003/0112382 (2003-06-01), Takahashi et al.
patent: 2004/0041958 (2004-03-01), Hwang et al.
patent: 2004/0097024 (2004-05-01), Doi

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