Copper cleaning and passivating for tape automated bonding

Details Copper cleaning and passivating for tape automated bonding Copper cleaning and passivating for tape automated bonding

1986-05-08

1987-12-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 3, 134 2219, 134 28, 134 29, 134 41, 156634, 156656, 156666, 156901, 252 792, 252 794, 252 795, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

047145170

ABSTRACT:
In the preparation of copper parts for the tape automated bonding of semiconductor devices, the copper parts are subjected to a mild organic acid. This treatment etches the copper, removes contaminants and passivates the surfaces so that subsequent oxidation is retarded. In the case where the copper parts are the bumps on a semiconductor wafer selective etching is avoided.

REFERENCES:
patent: 2318559 (1943-05-01), Percival
patent: 2382865 (1945-08-01), Dittmar
patent: 3095379 (1963-06-01), Schwartz
patent: 4127438 (1978-11-01), Babcock et al.
patent: 4264418 (1981-04-01), Wood et al.

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