Copper clad laminate

Details Copper clad laminate Copper clad laminate

2008-04-15

2008-04-15

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S700000, C428S607000

Reexamination Certificate

active

07358189

ABSTRACT:
To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.

REFERENCES:
patent: 3936548 (1976-02-01), Konicek
patent: 4313995 (1982-02-01), Delgadillo
patent: 4751146 (1988-06-01), Maeda et al.
patent: 5049221 (1991-09-01), Wada et al.
patent: 5102749 (1992-04-01), Enloe et al.
patent: 5153050 (1992-10-01), Johnston
patent: 5153077 (1992-10-01), Kashiba et al.
patent: 5254191 (1993-10-01), Mikeska et al.
patent: 5436301 (1995-07-01), Nishimura et al.
patent: 5583320 (1996-12-01), Eriguchi et al.
patent: 5674611 (1997-10-01), Saida et al.
patent: 5679230 (1997-10-01), Fatcheric et al.
patent: 5785789 (1998-07-01), Gagnon et al.
patent: 6027826 (2000-02-01), DeRochemont et al.
patent: 6197433 (2001-03-01), Hatano
patent: 6231742 (2001-05-01), Sano et al.
patent: 6270889 (2001-08-01), Kataoka et al.
patent: 6320140 (2001-11-01), Enomoto
patent: 6479170 (2002-11-01), Takahashi et al.
patent: 6489035 (2002-12-01), Wang et al.
patent: 6649274 (2003-11-01), Taenaka et al.
patent: 6652962 (2003-11-01), Sato et al.
patent: 6660406 (2003-12-01), Yamamoto et al.
patent: 6777108 (2004-08-01), Obata et al.
patent: 2001/0008091 (2001-07-01), Takahashi et al.
patent: 2001/0038911 (2001-11-01), Tsunashima et al.
patent: 2002/0005249 (2002-01-01), Kuwako et al.
patent: 2002/0192486 (2002-12-01), Chen et al.

Affiliated with

Also associated with

Rating

Copper clad laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper clad laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper clad laminate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2784924