Copper clad epoxy printed circuit board suitable for microwave f

Details Copper clad epoxy printed circuit board suitable for microwave f Copper clad epoxy printed circuit board suitable for microwave f

1992-02-04

1993-12-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156656, 156666, 156902, B44C 122, C23F 100

Patent

active

052680649

ABSTRACT:
A method for making printed circuit boards comprises using double treated copper foils for all inside conductor layers of multilayer packages with substrates of alloys of epoxy and polyphenylene oxide (PPO) resin to counteract the skin-effect encountered at high frequencies. Direct bonds between inside surfaces are then used without using an oxide step that introduces red/brown or black oxides.

REFERENCES:
patent: 3177103 (1965-04-01), Tally et al.
patent: 4659425 (1987-04-01), Eggers et al.
patent: 4902556 (1990-02-01), Benedikt et al.
patent: 4917758 (1990-04-01), Ishizuka et al.

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