Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-24
2005-05-24
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S675000, C438S678000, C205S157000, C205S295000, C205S296000
Reexamination Certificate
active
06897152
ABSTRACT:
The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated circuits. Specifically, the copper bath composition comprises water, copper ions, hydroxide ions, a complexing agent to inhibit the formation of copper oxides, copper hydroxides and copper salts, a stabilizer to control the rate of electroless copper plating, a reducing agent to promote the electroless reduction of the copper ions to copper metal, and a catalyst to promote the electrolytic reduction copper ions to copper metal.
REFERENCES:
patent: 4211564 (1980-07-01), Oka
patent: 4443257 (1984-04-01), Tomaiuolo et al.
patent: 4617205 (1986-10-01), Darken
patent: 5252196 (1993-10-01), Sonnenberg et al.
patent: 5453293 (1995-09-01), Beane et al.
patent: 5891513 (1999-04-01), Dubin et al.
patent: 6024856 (2000-02-01), Haydu et al.
patent: 6183545 (2001-02-01), Okuhama et al.
patent: 6258223 (2001-07-01), Cheung et al.
patent: 6271591 (2001-08-01), Dubin et al.
patent: 6319543 (2001-11-01), Soutar et al.
patent: 6528409 (2003-03-01), Lopatin et al.
patent: 20020011176 (2002-01-01), Yoshida et al.
patent: 20020064592 (2002-05-01), Datta et al.
patent: 20020152955 (2002-10-01), Dordi et al.
patent: 20030054094 (2003-03-01), Itabashi et al.
patent: 1 160 356 (2001-12-01), None
patent: 07-268638 (1995-10-01), None
patent: WO 0146494 (2001-06-01), None
Hsu, D.T. et al., “Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment”, Journal of Material Science Letters 18 (1999), pp. 1465-1467.
Enthone Inc.
Senniger Powers
Smoot Stephen W.
LandOfFree
Copper bath composition for electroless and/or electrolytic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Copper bath composition for electroless and/or electrolytic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper bath composition for electroless and/or electrolytic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3387374