Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1991-09-10
1999-07-20
Turner, Archene
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428428, 428457, 428469, 428472, 428323, 428325, 428901, 428697, 252512, 252518, H01B 106
Patent
active
059254432
ABSTRACT:
A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
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Farooq, et al., U.S. Patent Application S/N 07/672,517, filed Mar. 20, 1991 (to be issued as U.S. Pat. 5,073,180 on Dec. 17, 1991).
Aoude Farid Youssif
David Lawrence Daniel
Divakaruni Renuka Shastri
Farooq Shaji
Herron Lester Wynn
Blecker Ira D.
International Business Machines - Corporation
Turner Archene
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