Copper-based metal polishing solution and method for manufacturi

Details Copper-based metal polishing solution and method for manufacturi Copper-based metal polishing solution and method for manufacturi

1994-12-09

1996-11-19

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566361, 1566561, 1566371, 252 794, 437228, 216 38, H01L 2100, C23F 100, B44C 122

Patent

active

055758851

ABSTRACT:
Disclosed is a copper-based metal polishing solution which hardly dissolves a Cu film or a Cu alloy film when the film is dipped into the solution, and has a dissolution velocity during polishing several times higher than that during dipping. This copper-based metal polishing solution contains at least one organic acid selected from aminoacetic acid and amidosulfuric acid, an oxidizer, and water.

REFERENCES:
patent: 4954142 (1990-09-01), Carr et al.
patent: 4956313 (1990-09-01), Cote et al.
patent: 5225034 (1993-07-01), Yu et al.

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